About the role#
As a Wafer Bonding Process Development Intern, you will work within the Technology Development organization in Boise, Idaho. You will contribute to the research and optimization of wafer bonding technologies for future semiconductor products. You will work alongside experienced engineers to design experiments, evaluate new equipment, and analyze data to improve process performance and yield. This role involves using artificial intelligence and advanced analytics to support process development.
What you'll do#
- Support the research and development of manufacturable wafer bonding technologies for next-generation devices.
- Plan, execute, and analyze experiments, then communicate findings through technical reports and presentations.
- Identify and implement process improvements to enhance yield, quality, and manufacturing readiness.
- Evaluate new wafer bonding equipment, materials, and process solutions through structured characterization.
- Leverage artificial intelligence and AI-enabled tools to improve productivity and accelerate learning.
What you'll need#
- Currently pursuing an MS or PhD in Chemical Engineering, Chemistry, Materials Science, Electrical Engineering, or a related technical field.
- Demonstrated understanding of wafer bonding principles and semiconductor processing.
- Research, laboratory, or project experience in a semiconductor-related field.
- Working knowledge of statistics and experimental design methodologies.
- Strong written, verbal, and presentation skills.
Location & details#
- This is a full-time, paid internship based in Boise, Idaho.
- The role is on-site.
- The term is rolling.
About Micron Technology
Micron Technology produces memory and storage solutions including DRAM, NAND, and NOR products. The company operates as a public organization with over 43,000 employees. Founded in 1978, it maintains its headquarters in Boise, Idaho. Micron serves various markets ranging from data centers to mobile devices.
How to get in at Micron Technology
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