About the role#
Intel Technology Research is working on advanced packaging and 3D heterogeneous integration to support AI and high-performance computing. As an intern, you will work with researchers, process engineers, and modeling experts to develop and evaluate next-generation package architectures. This role involves research and development across package integration, process flow definition, modeling, yield assessment, and data analytics.
What you'll do#
- Support integration activities across wafer-level and package-level process flows, including 2.5D/3D integration and chiplet integration.
- Develop and execute Design of Experiments (DOE) to study the relationships between package architecture, process conditions, material behavior, and performance.
- Build, calibrate, and apply simulation models to understand mechanical characteristics, interconnect quality, and thermal performance.
- Conduct thermo-mechanical simulations to evaluate material responses to temperature, stress, and loading conditions.
- Analyze inspection, process, and simulation data to identify root causes of integration challenges and recommend improvements.
- Collaborate with cross-functional teams to optimize process flows for yield, reliability, and manufacturability.
- Present findings through technical presentations and potential publications.
What you'll need#
- Current pursuit of a PhD in Mechanical Engineering, Materials Science and Engineering, Electrical Engineering, Physics, Manufacturing Engineering, or a related STEM field.
- Availability to work full-time for a 3-month internship.
- At least 3 months of experience in laboratory experimentation, engineering data analysis, simulation workflows, process integration, or module development.
- Experience with programming or data analysis tools such as Python, MATLAB, JMP, or R.
- Experience in statistical analysis, DOE, or machine learning.
- Preferred: 6+ months of experience in advanced packaging, heterogeneous integration, chiplet integration, or package assembly.
- Preferred: 6+ months of experience in thermal, mechanical, or electrical modeling, finite element analysis, or failure analysis.
Location & details#
- Locations: Phoenix, Arizona or Hillsboro, Oregon.
- Work model: Hybrid and on-site.
- Employment type: Full-time internship.
About Intel Corporation
Intel Corporation designs and manufactures semiconductors. The company focuses on artificial intelligence, autonomous driving, and non-volatile memory solutions. It operates as a public company with over 110,000 employees. The headquarters are in Santa Clara, California, with major office locations across the United States, Israel, France, Singapore, and Poland.
How to get in at Intel Corporation
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